ACM Research enters the coatings/developer market for

FREMONT, Calif., Nov. 17, 2022 (GLOBE NEWSWIRE) — ACM Research, Inc. (ACM) (NASDAQ: ACMR), a leading provider of wafer processing solutions for semiconductor and advanced Wafer Level Packaging (WLP), Today, through its operating subsidiary ACM Research (Shanghai), Inc., introduced its Ultra Track tool, marking its entry into the track market. ACM’s participation in this new product category is a natural evolution of its expertise in cleaning, coating and systems development. The company completed R&D for its first stand-alone coating tool and development tool for packaging in 2013 and delivered them in 2014. ACM plans to ship the first Ultra Track Coater/Developer ArF tool to a Chinese customer within a few weeks, and an i-line model in 2023, and has also started development of a KrF model.

“I am pleased to announce ACM’s entry into the track market, a major new product category for our company. According to Gartner, the global crawler market is expected to reach US$3.7 billion in 2022, making this a significant new opportunity for ACM,” said David Wang, Founder and CEO of ACM. “ACM’s core competencies in software and robotics, combined with the proven performance of our coating and development tools and our new proprietary architecture, position us to enter the track market with a competitive product offering. This marks our first entry to support the frontal lithography process of today and tomorrow. We see good demand potential and believe that many global logic and memory manufacturers are looking for a second source of suppliers.

ACM’s Ultra Track is a 300mm processing tool that provides even airflow, fast robot handling, and customizable software to meet specific customer needs. The tool has several features that improve performance in terms of defect, throughput, and cost of ownership. The Ultra Track will support the full range of lithography applications including i-line, KrF and ArF processes.

Coating/developer lane tools support the photolithography process, ensuring ideal conditions for the entire process and optimizing the coating and development stages before and after wafer exposure in a lithography tool. Designed to support 300mm wafers, the Ultra Track features four 12-inch loading ports, 8 coating chambers, and 8 development chambers. The chamber temperature is maintained at 23°C ± 0.1°C with a cooking range of 50 to 250°C. The tool achieves

Forward-looking statements

Certain statements in this press release are not historical facts and may be forward-looking statements within the meaning of the Private Securities Litigation Reform Act of 1995. first ArF tool; the expected size of the global caterpillar market; the competitiveness and demand of the Company’s product offering in the track market; and the expected increase in throughput of the Company’s proceeds. Forward-looking statements are based on the current expectations and beliefs of ACM’s management, and involve a number of risks and uncertainties that are difficult to predict and that could cause actual results to differ materially from those indicated or disclosed. – understood by forward-looking statements. These risks and uncertainties include, but are not limited to, the following, each of which could be further exacerbated by the continued COVID-19 outbreak in China and globally: anticipated customer orders or market opportunities identified may not grow or develop as expected; customer orders already received may be postponed or cancelled; ACM may be unable to obtain qualification and acceptance of its delivered tools when scheduled or at all, which would delay or prevent ACM’s recognition of revenue from the sale of such tools; vendors may not be able to respond to ACM requests in a timely manner; ACM’s technologies and tools may not gain market acceptance; ACM may not be able to compete effectively by, among other things, improving its existing tools, adding additional production capacity and engaging other significant customers; ACM may incur significant expenses long before it can recognize new product revenue, if at all, due to the costs and length of research, development, manufacturing and customer evaluation cycles; volatility in global economic, market, industry and other conditions could cause a sharp decline in demand for products containing semiconductors and ACM’s products and disrupt capital and credit markets ; ACM’s inability to successfully manage its operations, including its inability to hire, train, onboard and manage additional qualified engineers for research and development activities; and trade regulations, including those recently issued by the U.S. Department of Commerce imposing certain restrictions on equipment shipments and business practices with China-based semiconductor manufacturers, currency fluctuations, political instability, and war, all of which may materially and adversely affect ACM due to its large non-U.S. customer and supplier base and significant non-U.S. manufacturing operations. A more detailed description of these risks, uncertainties and other matters can be found in ACM’s filings with the United States Securities and Exchange Commission. Because forward-looking statements involve risks and uncertainties, actual results and events may differ materially from results and events currently expected by ACM. ACM undertakes no obligation to publicly update these forward-looking statements to reflect events or circumstances that occur after the date hereof or to reflect any change in its expectations regarding these forward-looking statements or the occurrence of unforeseen events.

About ACM Research, Inc.
ACM develops, manufactures and sells semiconductor processing equipment for wet or batch cleaning, electroplating, stressless polishing and vertical oven processes, which are essential for advanced semiconductor device manufacturing. conductors and packaging at the wafer level. The company is committed to providing customized, high-performance, and cost-effective process solutions that semiconductor manufacturers can use across many manufacturing stages to improve productivity and product yield. For more information, visit

© ACM Research, Inc. Smart Megasonix and the ACM Research logo are registered trademarks of ACM Research, Inc. For convenience, this mark appears in this press release without the ™ symbol, but this practice does not imply that ACM will not assert, to the fullest extent consistent with applicable law, its rights in this mark.

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Jillian Carapella UNITED STATES
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+1 646.402.2408 +1 503.367.9753
Xi Wang
ACM Research (Shanghai), Inc.
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A.A. Kim
ACM Research (Korea), Inc.
David Chang
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Adrian Ong
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